
As a leading role in the global megatrend of scientific innovation, China has been creating a more and more open environment for scientific innovation, increasing the depth and breadth of academic cooperation, and building a community of innovation that benefits all. Such endeavors are making new contributions to globalization and creating a community of shared future.
The 6th International Conference on Electronics Technology and Artificial Intelligence (ETAI 2027) is scheduled to be held in Harbin, China from March 5 to 7, 2027. This conference takes "bringing together global wisdom in scientific innovation to promote high-quality development" as the theme and focuses on cutting-edge research fields including electronics technology and artificial intelligence. This conference aims to boost the development of the Greater Bay Area, expand channels of international academic exchange in science and technology, build a sharing platform of academic resources, promote scientific innovation on a global scale, strengthen academic cooperation between China and the outside world, enhance the development of new energy and materials and IT, AI, and biomedicine industries. It also aims to encourage the exchange of information on the frontiers of research in different areas, connect the most advanced academic resources in China and the world, turn research results into industrial solutions, and bring together talents, technologies, and capital to boost development.
Full Paper
Submission Date
January
15
2027
Final Paper
Submission Date
February
02
2027
Registration
Deadline
January
20
2027
Conference
Dates
March
05-07
2027

Countdown to the Conference:
The topics of interest for submission include, but are not limited to:
📚︎Electronics Technology
· Analog Electronics
· Digital Electronics
· Power Electronics Technology
· Variable current technology
· Electronic device equipment
· Electronic Signals
· Fiber Optics and Fiber Optic Devices
· Giant Area Microelectronics
· Electronic Information Technology
· Adaptive Signal Processing
· Advanced Electromagnetics
· MEMS Component Technology
· Electronic System Level Design
· Electronics and Nanoelectronics
· Epitaxy and Light Emitting Diodes
· Three-dimensional semiconductor device technology
· Circuit Analysis and Design
· Advanced Electromagnetics
· Communication Electronic Circuits
· Integrated Circuit Design and Integrated Systems
· Microwave Photonic Device Physics
· Integrated Optics
· Micro/nano systems and networks
· Digital Signal Processing
📚︎Artificial Intelligence
· Artificial Intelligence Algorithms
· Natural Language Processing
· Fuzzy Logic
· Computer Vision
· Signal and Image Processing
· Speech and Natural Language Processing
· Machine Learning
· Artificial Intelligence Modeling and Simulation
· Pervasive Computing
· Hybrid Intelligent Systems
· Information Retrieval and Fusion
· Microcontroller Technology
· Intelligent Database Systems
· Neural Networks and Complex Systems
· Pattern Recognition and Logic Programs
· Intelligent Control
All accepted full papers will be published in the conference proceedings and will be submitted to EI Compendex / Scopus for indexing.
ETAI 2026 | ||
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📚︎Ei Compendex |
📚︎Scopus |
ETAI 2025 | ||
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📚︎Ei Compendex |
📚︎Scopus |
ETAI 2024 | ||
📚︎Cover |
📚︎Ei Compendex |
📚︎Scopus |
ETAI 2023 | ||
📚︎Cover |
📚︎Ei Compendex |
📚︎Scopus |
ETAI 2022 | ||
📚︎Cover |
📚︎Ei Compendex |
📚︎Scopus |
Note: All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.

Contact
Conference Secretary: Summer Pan
Tel: +86-18922107265(Wechat)
E-Mail: pansiyuan@ais.cn
If you have any questions or inquiries, please feel free to contact us.